Source: Reuters (via feed)
Broadcom expects to sell at least 1 million 3D stacked chips by 2027, a company executive told Reuters on Wednesday. These chips use a stacked design technology that improves performance and efficiency. The firm specializes in artificial intelligence chip design.
The executive did not provide specific sales targets for the near term. However, this goal reflects strong confidence in the advanced chip technology. The company plans to expand the use of these chips in various applications. Meanwhile, demand for AI-related semiconductors continues to grow globally.
Broadcom’s push into 3D stacked chip sales comes amid a broader industry trend toward high-performance computing solutions. These chips allow for more computing power in a smaller space. As a result, they appeal to data centers and other technology sectors requiring advanced processing capabilities.
Broadcom’s 3D stacked chip sales target signals its focus on growing the AI semiconductor market segment.
